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WF5027 series Crystal Oscillator Module ICs
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OVERVIEW
The WF5027 series are miniature crystal oscillator module ICs. The oscillator circuit stage has voltage regulator drive, significantly reducing current consumption and crystal current, compared with existing devices, and significantly reducing the oscillator characteristics supply voltage dependency. There are 3 pad layout package options available for optimized mounting, making these devices ideal for miniature crystal oscillators.
FEATURES
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Wide range of operating supply voltage: 1.60 to 3.63V Regulated voltage drive oscillator circuit for reduced power consumption and crystal drive current Optimized low crystal drive current oscillation for miniature crystal units 3 pad layout options for mounting * 5027Ax, Mx, Qx series: for Flip Chip Bonding * 5027Bx, Nx, Rx series: for Wire Bonding (type I) * 5027Cx, Px, Sx series: for Wire Bonding (type II) Recommended oscillation frequency range For fundamental oscillator * Low frequency version: 20MHz to 60MHz * High frequency version: 60MHz to 100MHz For 3rd overtone oscillator * Low frequency version: 40MHz to 110MHz * High frequency version*1: 110MHz to 180MHz
*1: under development
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Multi-stage frequency divider for low-frequency output support: 0.9MHz (min) Frequency divider built-in (for fundamental oscillator) * Selectable by version: fO, fO/2, fO/4, fO/8, fO/16, fO/32, fO/64 -40 to 85C operating temperature range Standby function * High impedance in standby mode, oscillator stops CMOS output duty level (1/2VDD) 50 5% output duty 15pF output drive capability Wafer form (WF5027xx) Chip form (CF5027xx)
APPLICATIONS
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3.2 x 2.5, 2.5 x 2.0, 2.0 x 1.6 size miniature crystal oscillator modules
ORDERING INFORMATION
Device WF5027xx-4 CF5027xx-4 Package Wafer form Chip form
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WF5027 series
SERIES CONFIGURATION
For Fundamental Oscillator
Operating Output drive www..com supply capability voltage range [mA] [V] PAD layout Recommended oscillation frequency range*1 [MHz] 20 to 60 60 to 100 20 to 60 60 to 100 20 to 60 60 to 100 Version*2 fO output 5027A1 5027AP 5027B1 5027BP 5027C1 5027CP fO/2 output 5027A2 5027AQ 5027B2 5027BQ 5027C2 5027CQ fO/4 output 5027A3 5027AR 5027B3 5027BR 5027C3 5027CR fO/8 output 5027A4 5027AS 5027B4 5027BS 5027C4 5027CS fO/16 output 5027A5 5027AT 5027B5 5027BT 5027C5 5027CT fO/32 output 5027A6 5027AV 5027B6 5027BV 5027C6 5027CV fO/64 output 5027A7 5027AW 5027B7 5027BW 5027C7 5027CW
Flip Chip Bonding 1.60 to 3.63 4 Wire Bonding Type I Wire Bonding Type II
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. *2. Wafer form devices have designation WF5027xx and chip form devices have designation CF5027xx.
For 3rd Overtone Oscillator
Operating Output drive supply capability voltage range [mA] [V] Recommended oscillation frequency range*1 [MHz] and version*2 PAD layout 40 to 50 Flip Chip Bonding 1.60 to 3.63 8 Wire Bonding Type I Wire Bonding Type II 5027MA 5027NA 5027PA 50 to 65 5027MB 5027NB 5027PB 65 to 85 5027MC 5027NC 5027PC 85 to 110 5027MD 5027ND 5027PD 110 to 145 145 to 180 (5027QE) (5027RE) (5027SE) (5027QF) (5027RF) (5027SF)
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. *2. Wafer form devices have designation WF5027xx and chip form devices have designation CF5027xx. Versions in parentheses ( ) are under development.
VERSION NAME
Device WF5027xx-4 Package Wafer form Version name
WF5027
Form WF: Wafer form CF: Chip (Die) form
-4
Oscillation frequency range, frequency divider function Pad layout type A, M, Q: for Flip Chip Bonding B, N, R: for Wire Bonding (type I) C, P, S: for Wire Bonding (type II)
CF5027xx-4
Chip form
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WF5027 series
PAD LAYOUT
(Unit: m)
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5027Ax, Mx, Qx (for Flip Chip Bonding)
(750,690) VSS 5 6 1 (0,0) XT X 2 XTN 4 3 Q VDD
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5027Bx, Nx, Rx (for Wire Bonding (type I))
(750,690) Q 5 6 1 (0,0) XTN X 2 XT 4 3 VSS INHN
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5027Cx, Px, Sx (for Wire Bonding (type II))
(750,690) VDD 5 6 1 (0,0) XT X 2 XTN 4 3 Q VSS
Y INHN
Y
VDD
Y INHN
Chip size: 0.75 x 0.69mm Chip thickness: 130 15m PAD size: 90m Chip base: VSS level
Chip size: 0.75 x 0.69mm Chip thickness: 130 15m PAD size: 90m Chip base: VSS level
Chip size: 0.75 x 0.69mm Chip thickness: 130 15m PAD size: 90m Chip base: VSS level
PAD DIMENSIONS
Pad dimensions [m] Pad No. X 1 2 3 4 5 6 229 520 636 636 114 114 Y 114 114 304 531 531 304
PIN DESCRIPTION
Pad No. 5027Ax 5027Bx 5027Cx 5027Mx 5027Nx 5027Px 5027Qx 5027Rx 5027Sx 1 2 3 4 5 6 2 1 6 5 4 3 1 2 5 4 3 6 Pin Name Description
XT XTN VDD Q VSS INHN
Amplifier input Amplifier output (+) supply voltage Output (-) ground Output state control input
Crystal connection pins. Crystal is connected between XT and XTN. - Output frequency determined by internal circuit to one of fO, fO/2, fO/4, fO/8, fO/16, fO/32, fO/64 - High impedance when LOW (oscillator stops). Power-saving pull-up resistor built-in.
BLOCK DIAGRAM
VDD VSS
INHN
VRG RF DIVIDER CMOS
Q
XT
RD CG CD
XTN
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WF5027 series
VERSION DISCRIMINATION INTERNAL COMPONENTS
The WF5027 series device version is not determined solely by the mask pattern, but can also be determined by the trimming of internal trimming fuses.
www..com I Version
determined by laser trimming:
These chips are produced from a common device by the laser trimming of fuses corresponding to the ordered version, shown in table 1. These devices are shipped for electrical characteristics testing. Laser-trimmed versions are identified externally by the combination of the version name marking (1) and the locations of trimmed fuses (2).
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Version determined by mask pattern:
These chips are fabricated using the mask corresponding to the ordered version, and do not require trimming. Mask-fabricated versions are identified externally by the version name marking (1) only. Since the WF5027 series devices are manufactured using 2 methods, there are 2 types of IC chip available (identified externally) for the same version name. The identification markings for all WF5027 series device versions is shown in table 2.
(750,690)
(1) Version code on die
5027
NPC
(2) Trimming fuses F1 F2 F3
F4
F5
F6
F7
F8
F9
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WF5027 series
Table 1. Version and trimming fuses (for fundamental oscillator)
www..com Version F1 5027x1 5027x2 5027x3 5027x4 5027x5 5027x6 5027x7 5027xP 5027xQ 5027xR 5027xS 5027xT 5027xV 5027xW - x - x - x - - x - x - x - Trimming fuse number*1 F2 - - x x - - x - - x x - - x F3 - - - - x x x - - - - x x x F4 - - - - - - - x x x x x x x F5 - - - - - - - x x x x x x x
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5027x1 trimming fuses (untrimmed)
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5027x2 trimming fuses (F1 link trimmed)
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5027x3 trimming fuses (F2 link trimmed)
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5027x4 trimming fuses (F1 and F2 links trimmed)
*1. -: untrimmed, x: trimmed, F6 to F9 not used
: trimmed device
Table 2. Version and trimming fuses (for 3rd overtone oscillator)
Version 5027xA 5027xB 5027xC 5027xD 5027xE 5027xF Recommended oscillation frequency range*1 [MHz] 40 to 50 50 to 65 65 to 85 85 to 110 (110 to 145) TBD (145 to 180) *1. Values in parentheses ( ) are provisional only. *2. -: untrimmed, x: trimmed Trimming fuse number*2 F1 - - x - F2 - x x x F3 - - - x F4 - - - x F5 - - x x F6 - - - - F7 x - x x F8 x x - - F9 x x x x
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WF5027 series
Table 3. Version identification by version name and chip markings (for fundamental oscillator)
Version set by trimming fuses Version www..com name Version code on chip AX AX AX AX AX AX AX AX AX AX AX AX AX AX BX BX BX BX BX BX BX BX BX BX BX BX BX BX CX CX CX CX CX CX CX CX CX CX CX CX CX CX Trimming fuses*1 F1 - x - x - x - - x - x - x - - x - x - x - - x - x - x - - x - x - x - - x - x - x - F2 - - x x - - x - - x x - - x - - x x - - x - - x x - - x - - x x - - x - - x x - - x F3 - - - - x x x - - - - x x x - - - - x x x - - - - x x x - - - - x x x - - - - x x x F4 - - - - - - - x x x x x x x - - - - - - - x x x x x x x - - - - - - - x x x x x x x F5 - - - - - - - x x x x x x x - - - - - - - x x x x x x x - - - - - - - x x x x x x x Untrimmed F6 F7 F8 F9 Version set by mask pattern Version code on chip AX A2 A3 A4 A5 A6 A7 AP AQ AR AS AT AV AW BX B2 B3 B4 B5 B6 B7 BP BQ BR BS BT BV BW CX C2 C3 C4 C5 C6 C7 CP CQ CR CS CT CV CW Untrimmed Trimming fuses F1 to F9
5027A1 5027A2 5027A3 5027A4 5027A5 5027A6 5027A7 5027AP 5027AQ 5027AR 5027AS 5027AT 5027AV 5027AW 5027B1 5027B2 5027B3 5027B4 5027B5 5027B6 5027B7 5027BP 5027BQ 5027BR 5027BS 5027BT 5027BV 5027BW 5027C1 5027C2 5027C3 5027C4 5027C5 5027C6 5027C7 5027CP 5027CQ 5027CR 5027CS 5027CT 5027CV 5027CW
*1. -: untrimmed, x: trimmed SEIKO NPC CORPORATION --6
WF5027 series
Table 4. Version identification by version name and chip markings (for 3rd overtone oscillator)
Version set by trimming fuses www..com Version name Version code on chip F1 5027MA 5027MB 5027MC 5027MD 5027NA 5027NB 5027NC 5027ND 5027PA 5027PB 5027PC 5027PD (5027QE) (5027QF) (5027RE) (5027RF) (5027SE) (5027SF) *1. -: untrimmed, x: trimmed MX MX MX MX NX NX NX NX PX PX PX PX - - x - - - x - - - x - F2 - x x x - x x x - x x x F3 - - - x - - - x - - - x Trimming fuses*1 F4 - - - x - - - x - - - x F5 - - x x - - x x - - x x F6 - - - - - - - - - - - - F7 x - x x x - x x x - x x F8 x x - - x x - - x x - - F9 x x x x x x x x x x x x MA MB MC MD NA NB Untrimmed NC ND PA PB PC PD Version set by mask pattern Version code on chip Trimming fuses F1 to F9
TBD
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WF5027 series
SPECIFICATIONS
Absolute Maximum Ratings
VSS = 0V www..com
Parameter Supply voltage range Input voltage range Output voltage range Storage temperature range Output current Symbol VDD VIN VOUT TSTG IOUT Condition Between VDD and VSS Input pins Output pins Wafer form Q pin Rating -0.5 to +4.0 -0.5 to VDD + 0.5 -0.5 to VDD + 0.5 -65 to +150 20 Unit V V V C mA
Recommended Operating Conditions
For Fundamental Oscillator VSS = 0V
Rating Parameter Operating supply voltage Input voltage Operating temperature Oscillation frequency*1 Symbol VDD VIN TOPR 5027x1 to 5027x7 fO 5027xP to 5027xW CL 15pF 5027x1 to 5027x7 5027xP to 5027xW CL 15pF Input pins Condition min 1.60 VSS -40 20 60 0.9 0.9 typ - - - - - - - max 3.63 VDD +85 60 100 60 100 V V C MHz MHz MHz MHz Unit
Output frequency
fOUT
*1. The oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated.
For 3rd Overtone Oscillator VSS = 0V
Rating Parameter Operating supply voltage Input voltage Operating temperature Symbol VDD VIN TOPR 5027xA Oscillation frequency*1 5027xB fO 5027xC 5027xD CL 15pF Input pins Condition min 1.60 VSS -40 40 50 65 85 typ - - - - - - - max 3.63 VDD +85 50 65 85 110 V V C MHz MHz MHz MHz Unit
*1. The oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated.
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WF5027 series
Electrical Characteristics DC Characteristics
For Fundamental Oscillator: Low frequency version (5027x1 to 5027x7)
www..com VDD = 1.60 to 3.63V, VSS = 0V, Ta
= -40 to +85C unless otherwise noted.
Rating Condition min typ - - - - - - 1.6 1.3 1.0 1.5 1.2 0.9 1.3 1.0 0.8 1.1 0.9 0.75 1.05 0.85 0.7 1.0 0.85 0.7 1.0 0.85 0.7 - 1.5 70 100 6 10 max - 0.4 - 0.3VDD 10 - 2.4 2.0 1.5 2.3 1.8 1.4 2.0 1.5 1.2 1.7 1.4 1.15 1.6 1.3 1.1 1.5 1.3 1.1 1.5 1.3 1.1 10 8 150 200 7.2 12 V V V V A A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA A M k k pF pF Unit VDD - 0.4 - 0.7VDD - VOH = VDD VOL = VSS VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V - - 10 - - - - - - - - - - - - - - - - - - - - - - 0.4
Parameter HIGH-level output voltage LOW-level output voltage HIGH-level input voltage LOW-level input voltage Output leakage current
Symbol VOH VOL VIH VIL IZ
Q: Measurement cct 3, IOH = - 4mA Q: Measurement cct 3, IOL = 4mA INHN, Measurement cct 4 INHN, Measurement cct 4 Q: Measurement cct 5, INHN = LOW 5027x1 (fO), Measurement cct 1, no load, INHN = open, fO = 48MHz, fOUT = 48MHz 5027x2 (fO/2), Measurement cct 1, no load, INHN = open, fO = 48MHz, fOUT = 24MHz 5027x3 (fO/4), Measurement cct 1, no load, INHN = open, fO = 48MHz, fOUT = 12MHz 5027x4 (fO/8), Measurement cct 1, no load, INHN = open, fO = 48MHz, fOUT = 6MHz 5027x5 (fO/16), Measurement cct 1, no load, INHN = open, fO = 48MHz, fOUT = 3MHz 5027x6 (fO/32), Measurement cct 1, no load, INHN = open, fO = 48MHz, fOUT = 1.5MHz 5027x7 (fO/64), Measurement cct 1, no load, INHN = open, fO = 60MHz, fOUT = 0.94MHz
Current consumption*1
IDD
Standby current INHN pull-up resistance Oscillator feedback resistance Oscillator capacitance
IST RUP1 RUP2 Rf CG CD
Measurement cct 1, INHN = LOW Measurement cct 6
30 50 Design value (a monitor pattern on a wafer is tested), Excluding parasitic capacitance. 4.8 8
*1. The consumption current IDD (CL) with a load capacitance (CL) connected to the Q pin is given by the following equation, where IDD is the no-load consumption current and fOUT is the output frequency. IDD (CL) [mA] = IDD [mA] + CL [pF] x VDD [V] x fOUT [MHz] x 10-3
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WF5027 series For Fundamental Oscillator: High frequency version (5027xP to 5027xW) VDD = 1.60 to 3.63V, VSS = 0V, Ta = -40 to +85C unless otherwise noted.
www..com Parameter HIGH-level output voltage LOW-level output voltage HIGH-level input voltage LOW-level input voltage Output leakage current Rating Symbol VOH VOL VIH VIL IZ Condition min Q: Measurement cct 3, IOH = - 4mA Q: Measurement cct 3, IOL = 4mA INHN, Measurement cct 4 INHN, Measurement cct 4 Q: Measurement cct 5, INHN = LOW 5027xP (fO), Measurement cct 1, no load, INHN = open, fO = 80MHz, fOUT = 80MHz 5027xQ (fO/2), Measurement cct 1, no load, INHN = open, fO = 80MHz, fOUT = 40MHz 5027xR (fO/4), Measurement cct 1, no load, INHN = open, fO = 80MHz, fOUT = 20MHz 5027xS (fO/8), Measurement cct 1, no load, INHN = open, fO = 80MHz, fOUT = 10MHz 5027xT (fO/16), Measurement cct 1, no load, INHN = open, fO = 80MHz, fOUT = 5MHz 5027xV (fO/32), Measurement cct 1, no load, INHN = open, fO = 80MHz, fOUT = 2.5MHz 5027xW (fO/64), Measurement cct 1, no load, INHN = open, fO = 80MHz, fOUT = 1.25MHz Standby current INHN pull-up resistance Oscillator feedback resistance Oscillator capacitance IST RUP1 RUP2 Rf CG CD Design value (a monitor pattern on a wafer is tested), Excluding parasitic capacitance. Measurement cct 1, INHN = LOW Measurement cct 6 30 50 1.6 3.2 70 100 2 4 150 200 2.4 4.8 k k pF pF VOH = VDD VOL = VSS VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD - 0.4 - 0.7VDD - - - 10 - - - - - - - - - - - - - - - - - - - - - - 0.4 typ - - - - - - 2.5 2.0 1.6 2.4 1.9 1.5 1.8 1.5 1.2 1.7 1.4 1.1 1.6 1.3 1.0 1.5 1.2 1.0 1.5 1.2 1.0 - 1.5 max - 0.4 - 0.3VDD 10 - 3.8 3.0 2.4 3.6 2.9 2.3 2.7 2.3 1.6 2.6 2.1 1.7 2.4 2.0 1.5 2.3 1.8 1.5 2.3 1.8 1.5 10 8 V V V V A A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA A M Unit
Current consumption*1
IDD
*1. The consumption current IDD (CL) with a load capacitance (CL) connected to the Q pin is given by the following equation, where IDD is the no-load consumption current and fOUT is the output frequency. IDD (CL) [mA] = IDD [mA] + CL [pF] x VDD [V] x fOUT [MHz] x 10-3
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WF5027 series For 3rd Overtone Oscillator (5027xA to 5027xD) VDD = 1.60 to 3.63V, VSS = 0V, Ta = -40 to +85C unless otherwise noted.
Rating Parameter www..com Symbol Condition min Q: Measurement cct 3, IOH = - 8mA, VDD = 2.25 to 3.63V Q: Measurement cct 3, IOH = - 4mA, VDD = 1.60 to 2.25V Q: Measurement cct 3, IOL = 8mA, VDD = 2.25 to 3.63V Q: Measurement cct 3, IOL = 4mA, VDD = 1.60 to 2.25V INHN, Measurement cct 4 INHN, Measurement cct 4 Q: Measurement cct 5, INHN = LOW VOH = VDD VOL = VSS VDD = 3.3V 5027xA, Measurement cct 1, no load, INHN = open, fO = 48MHz VDD = 2.5V VDD = 1.8V VDD = 3.3V 5027xB, Measurement cct 1, no load, INHN = open, fO = 54MHz Current consumption*1 IDD 5027xC, Measurement cct 1, no load, INHN = open, fO = 85MHz VDD = 2.5V VDD = 1.8V VDD = 3.3V VDD = 2.5V VDD = 1.8V VDD = 3.3V 5027xD, Measurement cct 1, no load, INHN = open, fO = 100MHz Standby current INHN pull-up resistance IST RUP1 RUP2 5027xA Oscillator feedback resistance 5027xB Rf 5027xC 5027xD 5027xA CG Design value (a monitor pattern on a wafer is tested), Excluding parasitic capacitance. 5027xB 5027xC 5027xD Oscillator capacitance 5027xA CD Design value (a monitor pattern on a wafer is tested), Excluding parasitic capacitance. 5027xB 5027xC 5027xD 9.6 9.6 6.4 4.8 12 12 8 6 14.4 14.4 9.6 7.2 pF pF pF pF Measurement cct 1, INHN = LOW Measurement cct 6 30 2.6 2.2 1.9 1.9 9.6 6.4 4.8 1.6 70 3.8 3.2 2.8 2.8 12 8 6 2 150 5.0 4.2 3.7 3.7 14.4 9.6 7.2 2.4 k k k k k pF pF pF pF VDD = 2.5V VDD = 1.8V VDD - 0.4 VDD - 0.4 - - 0.7VDD - - - 10 - - - - - - - - - - - - - 0.4 typ - - - - - - - - 3.6 3.0 2.6 3.8 3.2 2.8 4.8 4.0 3.4 5.3 4.4 3.6 - 1.5 max - - 0.4 0.4 - 0.3VDD 10 - 5.4 4.5 3.9 5.7 4.8 4.2 7.2 6.0 5.1 8.0 6.6 5.4 10 8 V V V V V V A A mA mA mA mA mA mA mA mA mA mA mA mA A M Unit
HIGH-level output voltage
VOH
LOW-level output voltage
VOL
HIGH-level input voltage LOW-level input voltage Output leakage current
VIH VIL IZ
*1. The consumption current IDD (CL) with a load capacitance (CL) connected to the Q pin is given by the following equation, where IDD is the no-load consumption current and fOUT is the output frequency. IDD (CL) [mA] = IDD [mA] + CL [pF] x VDD [V] x fOUT [MHz] x 10-3
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WF5027 series
AC Characteristics
For Fundamental Oscillator (5027x1 to 5027x7, 5027xP to 5027xW) VDD = 1.60 www..com to 3.63V, VSS = 0V, Ta = -40 to +85C unless otherwise noted.
Symbol tr1 tr2 tf1 tf2 Duty tOD Condition Measurement cct 1, CL = 15pF, 0.1VDD to 0.9VDD Measurement cct 1, CL = 15pF, 0.9VDD to 0.1VDD VDD = 2.25 to 3.36V VDD = 1.60 to 2.25V VDD = 2.25 to 3.36V VDD = 1.60 to 2.25V Rating min - - - - 45 - typ 2.0 3.0 2.0 3.0 50 - max 4.5 5.0 4.5 5.0 55 50 Unit ns ns ns ns % s
Parameter
Output rise time
Output fall time Output duty cycle Output disable delay time
Measurement cct 1, Ta = 25C, CL = 15pF Measurement cct 2, Ta = 25C, CL 15pF
For 3rd Overtone Oscillator (5027xA to 5027xD) VDD = 1.60 to 3.63V, VSS = 0V, Ta = -40 to +85C unless otherwise noted.
Parameter Symbol tr1 tr2 tf1 tf2 Duty tOD Condition Measurement cct 1, CL = 15pF, 0.1VDD to 0.9VDD Measurement cct 1, CL = 15pF, 0.9VDD to 0.1VDD VDD = 2.25 to 3.36V VDD = 1.60 to 2.25V VDD = 2.25 to 3.36V VDD = 1.60 to 2.25V Rating min - - - - 45 - typ 1.2 1.6 1.2 1.6 50 - max 3.0 4.0 3.0 4.0 55 50 Unit ns ns ns ns % s
Output rise time
Output fall time Output duty cycle Output disable delay time
Measurement cct 1, Ta = 25C, CL = 15pF Measurement cct 2, Ta = 25C, CL 15pF
Timing chart
0.9VDD 0.9VDD
Q
0.1VDD
TW T
0.1VDD
DUTY measurement voltage (0.5V DD) DUTY= TW/ T 100 (%)
tr
tf
Figure 1. Output switching waveform
VIH VIL
INHN
tOD
0.1V
tSTR
Q
Normal operation Output stopped Hi-Z* Normal operation
When INHN goes HIGH to LOW, the Q output goes HIGH once and then becomes high impedance. When INHN goes LOW to HIGH, the Q output goes from high impedance to normal output operation when the oscillation starts (oscillation is detected). *) The high-impedance interval in the figure is shown as a LOW level due to the 1k pull-down resistor connected to the Q pin (see "Measurement circuit 2" in the "Measurement Circuits" section).
Figure 2. Output disable and oscillation start timing chart
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WF5027 series
FUNCTIONAL DESCRIPTION
Standby Function
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When INHN goes LOW, the Q output becomes high impedance.
INHN HIGH (or open) LOW Q Frequency output High impedance Oscillator Normal operation Stopped
Power-saving Pull-up Resistor
The INHN pin pull-up resistance RUP1 or RUP2 changes in response to the input level (HIGH or LOW). When INHN is tied LOW level, the pull-up resistance is large (RUP1), reducing the current consumed by the resistance. When INHN is left open circuit, the pull-up resistance is small (RUP2), which increases the input susceptibility to external noise. However, the pull-up resistance ties the INHN pin HIGH level to prevent external noise from unexpectedly stopping the output.
Oscillation Detector Function
The WF5027 series also feature an oscillation detector circuit. This circuit functions to disable the outputs until the oscillator circuit starts and oscillation becomes stable. This alleviates the danger of abnormal oscillator output at oscillator start-up when power is applied or when INHN is switched.
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WF5027 series
MEASUREMENT CIRCUITS
Measurement cct 1
Measurement parameter: IDD, IST, Duty, tr , tf
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Measurement cct 4
Measurement parameter: VIH, VIL
A
VDD X'tal 0.1F XTN INHN VSS IDD: Open IST: Short XT
IDD IST VDD XT IDD: Open Q X'tal XTN INHN VSS CL = 15pF (Including probe capacitance) VIH V VIL Q 0.1F
Note: The AC characteristics are observed using an oscilloscope on pin Q.
VIH: Voltage in VSS to VDD transition that changes the output state. VIL: Voltage in VDD to VSS transition that changes the output state. INHN has an oscillation stop function.
Measurement cct 2
Measurement parameter: tOD
Measurement cct 5
Measurement parameter: IZ
VDD C1 XTN INHN VSS R1 VDD
or
0.1F Q CL RL 0.1F
VDD VDD Q INHN VSS
Signal Generator
A
IZ
or
VSS
VSS
XTN input signal: 1Vp-p, sine wave C1: 0.001F CL: 15pF R1: 50 RL: 1k
Measurement cct 6
Measurement parameter: RUP1, RUP2
Measurement cct 3
Measurement parameter: VOH, VOL
VDD 0.1F
VDD 0.001F XTN VSS 50 Q VOH V VOL 0.1F 50
INHN VSS VDD IUP
Signal Generator
VIN V
0.1F VS
A IUP
RUP1 =
(VIN = 0V)
RUP2 = VDD 0.7VDD (VIN = 0.7VDD) IUP
V
VOH VS
VS VOL
V
VS adjusted such that V = 50 x IOH.
VS adjusted such that V = 50 x IOL.
XTN input signal: 1Vp-p, sine wave
SEIKO NPC CORPORATION --14
WF5027 series
TYPICAL PERFORMANCE (for fundamental oscillator)
The following characteristics measured using the crystal below. Note that the characteristics will vary with the crystal used.
www..com I Crystal
used for measurement
fO = 48MHz 1.6 12 fO = 80MHz 2.1 10
I
Crystal parameters
L1 C1 R1
Parameter C0 [pF] R1 []
C0
Current Consumption
10 10
Current consumption [mA]
Current consumption [mA]
8
8
6
6 CL = 15pF 4
4
CL = 15pF
2 CL = 0pF 0 1.5 2 2.5 VDD [V] 3 3.5 4
2 CL = 0pF 0 1.5 2 2.5 VDD [V] 3 3.5 4
5027A1, fOUT = 48MHz, Ta = 25C
5027AP, fOUT = 80MHz, Ta = 25C
Negative Resistance
Frequency [MHz] 10 0 20 30 40 50 60 0 50 60 Frequency [MHz] 70 80 90 100
-200 Negative resistance [] Negative resistance []
-200 C0 = 2pF
-400
-400
-600
-600 C0 = 1pF -800
-800 C0 = 2pF -1000 C0 = 1pF C0 = 0pF
C0 = 0pF -1000
5027x1 to x7, VDD = 3.3V, Ta = 25C
5027xP to xW, VDD = 3.3V, Ta = 25C
Characteristics are measured with a capacitance C0, representing the crystal equivalent circuit C0 capacitance, connected between the XT and XTN pins. Measurements are performed with Agilent 4396B using the NPC test jig. Characteristics may vary with measurement jig and measurement conditions.
SEIKO NPC CORPORATION --15
WF5027 series
Frequency Deviation by Supply Voltage Change
1 1
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0.5 f/f [ppm] f/f [ppm] 1.6 2.1 2.6 VDD [V] 3.1 3.6 0.5
0
0
-0.5
-0.5
-1
-1 1.6
2.1
2.6 VDD [V]
3.1
3.6
5027x1 to x7, fOUT = 48MHz, 3.3V standard, Ta = 25C
5027xP to xW, fOUT = 80MHz, 3.3V standard, Ta = 25C
Drive Level
50 50
40 Drive level [W] Drive level [W] 1.5 2 2.5 VDD [V] 3 3.5 4
40
30
30
20
20
10
10
0
0 1.5 2 2.5 VDD [V] 3 3.5 4
5027x1 to x7, fOUT = 48MHz, Ta = 25C
5027xP to xW, fOUT = 80MHz, Ta = 25C
Phase Noise
Measurement equipment: Agilent E5052 Signal Source Analyzer
-40 -60 Phase noise [dBc/Hz] Phase noise [dBc/Hz] 10 100 1,000 10,000 100,000 1,000,000 10,000,000 -80 -100 -120 -140 -160 -40 -60 -80 -100 -120 -140 -160 10
100
1,000
10,000
100,000
1,000,000 10,000,000
Offset frequency [Hz]
Offset frequency [Hz]
5027A1, VDD = 3.3V, fOSC = fOUT = 48MHz, Ta = 25C
5027AP, VDD = 3.3V, fOSC = fOUT = 80MHz, Ta = 25C
SEIKO NPC CORPORATION --16
WF5027 series
Output Waveform
Measurement equipment: Agilent 54855A Oscilloscope
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5027A1, VDD = 3.3V, fOUT = 48MHz, CL = 15pF, Ta = 25C
5027AP, VDD = 3.3V, fOUT = 80MHz, CL = 15pF, Ta = 25C
SEIKO NPC CORPORATION --17
WF5027 series
TYPICAL PERFORMANCE (for 3rd overtone oscillator)
The following characteristics measured using the crystal below. Note that the characteristics will vary with the crystal used.
www..com I Crystal
used for measurement
fO = 85MHz 0.9 56 fO = 100MHz 1.2 45
I
Crystal parameters
L1 C1 R1
Parameter C0 [pF] R1 []
C0
Current Consumption
12 10 Current consumption [mA] Current consumption [mA] 8 CL = 15pF 6 4 CL = 0pF 2 0 1.6 12 10 8 CL = 15pF 6 4 CL = 0pF 2 0 1.6
2.2
2.8 VDD [V]
3.4
4
2.2
2.8 VDD [V]
3.4
4
5027xD, fOUT = 85MHz, Ta = 25C
5027AP, fOUT = 100MHz, Ta = 25C
Negative Resistance
Frequency [MHz] 80 120 C0 = 2pF
Negative resistance []
0
0
40
160
200
-200 C0 = 1pF C0 = 0pF -600
1.8V 2.5V 3.3V 1.8V 2.5V 3.3V 1.8V 2.5V 3.3V
-400
-800 1.8V 2.5V 3.3V
-1000
5027xD, Ta = 25C, recommended operating frequency range: 85MHz to 110MHz
Characteristics are measured with a capacitance C0, representing the crystal equivalent circuit C0 capacitance, connected between the XT and XTN pins. Measurements are performed with Agilent 4396B using the NPC test jig. Characteristics may vary with measurement jig and measurement conditions.
SEIKO NPC CORPORATION --18
WF5027 series
Frequency Deviation by Supply Voltage Change
1
1
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0.5
f/f [ppm] f/f [ppm]
0.5
0
0
-0.5
-0.5
-1
-1
1.6
2.1
2.6 VDD [V]
3.1
3.6
1.6
2.1
2.6 VDD [V]
3.1
3.6
5027xD, fOUT = 85MHz, 3.3V standard, Ta = 25C
5027xD, fOUT = 100MHz, 3.3V standard, Ta = 25C
Drive Level
200 200
150 Drive level [W]
Drive level [W]
150
100
100
50
50
0
1.5
2
2.5 VDD [V]
3
3.5
4
0
1.5
2
2.5 VDD [V]
3
3.5
4
5027xD, fOUT = 85MHz, Ta = 25C
5027xD, fOUT = 100MHz, Ta = 25C
Phase Noise
Measurement equipment: Agilent E5052 Signal Source Analyzer
-40 -60 Phase noise [dBc/Hz] Phase noise [dBc/Hz] 10 100 1,000 10,000 100,000 1,000,000 10,000,000 -80 -100 -120 -140 -160 -40 -60 -80 -100 -120 -140 -160 10 100 1,000 10,000 100,000 1,000,000 10,000,000 Offset frequency [Hz] Offset frequency [Hz]
5027xD, VDD = 3.3V, fOSC = fOUT = 85MHz, Ta = 25C
5027xD, VDD = 3.3V, fOSC = fOUT = 100MHz, Ta = 25C
SEIKO NPC CORPORATION --19
WF5027 series
Output Waveform
Measurement equipment: Agilent 54855A Oscilloscope
www..com
5027xD, VDD = 3.3V, fOUT = 85MHz, CL = 15pF, Ta = 25C
5027xD, VDD = 3.3V, fOUT = 100MHz, CL = 15pF, Ta = 25C
SEIKO NPC CORPORATION --20
WF5027 series
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Please pay your attention to the following points at time of using the products shown in this document. The products shown in this document (hereinafter "Products") are not intended to be used for the apparatus that exerts harmful influence on human lives due to the defects, failure or malfunction of the Products. Customers are requested to obtain prior written agreement for such use from SEIKO NPC CORPORATION (hereinafter "NPC"). Customers shall be solely responsible for, and indemnify and hold NPC free and harmless from, any and all claims, damages, losses, expenses or lawsuits, due to such use without such agreement. NPC reserves the right to change the specifications of the Products in order to improve the characteristic or reliability thereof. NPC makes no claim or warranty that the contents described in this document dose not infringe any intellectual property right or other similar right owned by third parties. Therefore, NPC shall not be responsible for such problems, even if the use is in accordance with the descriptions provided in this document. Any descriptions including applications, circuits, and the parameters of the Products in this document are for reference to use the Products, and shall not be guaranteed free from defect, inapplicability to the design for the mass-production products without further testing or modification. Customers are requested not to export or re-export, directly or indirectly, the Products to any country or any entity not in compliance with or in violation of the national export administration laws, treaties, orders and regulations. Customers are requested appropriately take steps to obtain required permissions or approvals from appropriate government agencies.
SEIKO NPC CORPORATION
15-6, Nihombashi-kabutocho, Chuo-ku, Tokyo 103-0026, Japan Telephone: +81-3-6667-6601 Facsimile: +81-3-6667-6611 http://www.npc.co.jp/ Email: sales@npc.co.jp
NC0505CE 2007.03
SEIKO NPC CORPORATION --21

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